Lumped 3-D Equivalent Thermal Circuit Model for Transient Thermal Analysis of TSV Array

Abstract

This paper presents a lumped three-dimensional equivalent thermal circuit model for the transient thermal analysis of through silicon via (TSV) arrays. The distribution of heat source and the multiple directions of heat flow are both included. Thermal network is built up for TSV arrays with thermal resistances and capacitances analytically calculated from geometry and material parameters. With simulation conducted using a commonly-used modified nodal analysis solver, the transient variation and spatial distribution of temperature in both vertical and lateral directions can be captured. Numerical validations demonstrate that the proposed model greatly reduces simulation time while maintaining a good accuracy.