Broadband coplanar couplers in multilayer thin film MCM-D technology

Abstract

Multilayer thin film multichip module technology (MCM-D) is very well suited for high density integration of microwave circuits. This paper focuses on the design and realization of broadband coplanar couplers in MCM-D. By applying a general quasi-static calculation method, the modal electrical parameters of the couplers may be calculated very fast, allowing a quick determination of the coupler geometry. Design verifications by measurements indicate that broadband couplers may be realized efficiently in MCM-D.