Thermal influences on IC packages during manual soldering process

Abstract

The presented work investigates the manual soldering process and how the thermal phenomena can affect different ICs, depending on their form. The study was developed mainly for surface-mount devices because the assembling technique involves direct contact with the soldering iron. Simulations were carried out using SolidWorks Flow Simulation tool, following that practical experiment using a thermal camera to be done in order to understand exactly the process of manual soldering.