R. Endres, Tillmann A. Krauss, Frank Wessely, U. Schwalke
{"title":"Damascene metal gate technology for damage-free gate-last high-k process integration","authors":"R. Endres, Tillmann A. Krauss, Frank Wessely, U. Schwalke","doi":"10.1109/ICSCS.2009.5414209","DOIUrl":null,"url":null,"abstract":"In this work, we present MOS capacitors and MOS transistors with a crystalline gadolinium oxide (Gd<inf>2</inf>O<inf>3</inf>) gate dielectric and metal gate electrode (titanium nitride) fabricated in a replacement gate process. Initial results on ALD-TiN/Gd<inf>2</inf>O<inf>3</inf>/Si gate stacks on p- and n-substrates with equivalent oxide thicknesses (EOT) of 3.0nm and 1.5nm, respectively, are presented in this work.","PeriodicalId":126072,"journal":{"name":"2009 3rd International Conference on Signals, Circuits and Systems (SCS)","volume":"23 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2009-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 3rd International Conference on Signals, Circuits and Systems (SCS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICSCS.2009.5414209","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
In this work, we present MOS capacitors and MOS transistors with a crystalline gadolinium oxide (Gd2O3) gate dielectric and metal gate electrode (titanium nitride) fabricated in a replacement gate process. Initial results on ALD-TiN/Gd2O3/Si gate stacks on p- and n-substrates with equivalent oxide thicknesses (EOT) of 3.0nm and 1.5nm, respectively, are presented in this work.