Simulation Design and Optimization of Multi-Channel High-Frequency Transmission Lines Applied to Optical Modules

Abstract

Throughout this paper, the signal integrity (SI) problem of the high-frequency signal transmission of the electro absorption modulator (EAM) array chip has been solved, which is caused by crosstalk and signal reflection in the multi-transmission line. An eight-channel high-frequency transmission line structure is proposed and optimized through electromagnetic simulation. We proposed four structure that might improve the signal integrity, that is covering ground, siding metallization, grounding hole and all above at the same time. The simulation result shows that only covering ground and doing three methods at the same time can improve the signal integrity. The original model is processed with covering ground, the -3 dB bandwidth exceed 50 GHz, and the crosstalk between adjacent lines below -25 dB. Therefore, the Multi-channel transmission line we proposed could be applied to 800 G and 1.6 T EAM array chip.