XBOX Series X: A Next-Generation Gaming Console SoC

Abstract

The XBOX Series X System-on-Chip (SoC) delivers an enormous improvement over the prior generation with up to $2 \times$ GPU performance, $3 \times$ CPU performance, $2.4 \times$ GPU performance/W, $1.7 \times$ memory bandwidth and $2 \times$ IO bandwidth to feed the additional processing capability and features shown in Fig. 3.1.1. The chip is fabricated in TSMC’s N7 process node [6], containing 15.3B transistors on a 360.4mm2 die. It is packaged in $\mathrm{a}52.5 \times 52.5$ mm2 BGA using a 12-layer (5-2-5) substrate with 2963 balls and a 0.80mm minimum ball pitch. A die photo is shown in Fig. 3.1.7. The IO-limited chip floorplan is driven by DRAM connections on 3 sides of the chip.