The reliability challenge: New materials in the new millennium. Moore's Law drives a discontinuity

J. England, R. England
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引用次数: 2

Abstract

Nowhere is the pace of change so rapid or so dramatic as in the semiconductor industry. For any industry to sustain 15% growth per year over a 40-year period is remarkable, but in the next few years, that growth rate is expected to accelerate, creating an industry that rivals historically dominant industries such as automotive and steel for a share of the global economy. Moore's Law has proven remarkably successful in characterizing the growth of the semiconductor industry for the past three decades. During that period, the core microelectronic materials-silicon substrate, SiO/sub 2/-based dielectrics, and aluminum metallization-have undergone relatively minor perturbations. Now, however, a discontinuity in basic semiconductor materials will be necessary for the industry to continue on the curve described by Moore's Law. The materials on which careers have been based are giving way to new gate and interlevel dielectrics, and copper metallization is replacing aluminum-alloy metallization. Given the size of our industry and its impact on the global economy, an accelerated understanding of the reliability physics of these new materials is essential. This paper deals with the work environment, skills and methods required for the reliability scientist to prepare the semiconductor industry for the new millennium.
可靠性挑战:新千年的新材料。摩尔定律导致了不连续
没有哪个行业的变化速度比半导体行业更快、更剧烈。对于任何一个行业来说,在40年的时间里保持15%的年增长率都是了不起的,但在未来几年,这一增长率预计将加速,创造一个与汽车和钢铁等历史上占据主导地位的行业竞争全球经济份额的行业。事实证明,摩尔定律在描述过去三十年半导体行业的发展方面非常成功。在此期间,核心微电子材料-硅衬底,SiO/ sub2 /基介电材料和铝金属化-经历了相对较小的扰动。然而,现在,基本半导体材料的不连续性将是工业继续沿着摩尔定律所描述的曲线发展的必要条件。作为职业基础的材料正在让位于新的栅极和层间介质,铜金属化正在取代铝合金金属化。考虑到我们行业的规模及其对全球经济的影响,加速了解这些新材料的可靠性物理是至关重要的。本文论述了可靠性科学家为半导体工业准备新千年所需的工作环境、技能和方法。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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