Microcrack Initiation Mechanism of a Duplex Stainless Steel Under Very High Cycle Fatigue Loading Condition: The Significance of Load Partitioning and Micro Residual Stresses

Hongwang Fu, B. Dönges, U. Krupp, U. Pietsch, C. Fritzen, X. Yun, H. Christ
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引用次数: 15

Abstract

Abstract Investigation on the cyclic response of metallic materials in very high cycle fatigue (VHCF) is a challenging problem, which hinders the development of fatigue theories. To overcome this difficulty, we initially applied several sensible techniques, e.g., High-energy X-ray diffraction (HEXRD), confocal laser scanning microscope (CLSM), nanoindentation and transmission electron microscope (TEM) to investigate the cyclic response of a duplex stainless steel (DSS) in the VHCF regime. In-situ XRD and in-situ digital image correlation (DIC) experiments were subsequently performed at observed changing stages, intending to explore the underlying mechanism of microcrack initiation. The first-hand results obtained revealed that the austenite phase exhibits cyclic softening-hardening-softening behavior during the VHCF process. The in-situ investigations performed at the cyclic softening and hardening stages showed a load partitioning and a load transfer between the two phases, implying the cyclic response can significantly affect the distribution of the applied load. Residual strain obtained by DIC technique after unloading exhibited strong variations at phase boundaries, suggesting micro residual stresses have developed pronouncedly. Based on all the experimental findings, a unified crack initiation mechanism for the investigated DSS during VHCF loading was proposed.
高周疲劳条件下双相不锈钢微裂纹萌生机制:载荷分配和微残余应力的意义
金属材料在甚高周疲劳下的循环响应研究是一个具有挑战性的问题,阻碍了疲劳理论的发展。为了克服这一困难,我们首先应用了几种可行的技术,如高能x射线衍射(HEXRD)、共聚焦激光扫描显微镜(CLSM)、纳米压痕和透射电子显微镜(TEM)来研究双相不锈钢(DSS)在VHCF条件下的循环响应。随后,在观察到的变化阶段进行了原位XRD和原位数字图像相关(DIC)实验,旨在探索微裂纹起裂的潜在机制。第一手结果表明,在VHCF过程中,奥氏体相表现出循环软化-硬化-软化行为。在循环软化和硬化阶段进行的现场研究表明,在两个阶段之间存在载荷分配和载荷转移,这表明循环响应可以显著影响外加载荷的分布。通过DIC技术得到的卸载后的残余应变在相界处表现出强烈的变化,表明微残余应力已经明显发展。在此基础上,提出了所研究的DSS在VHCF加载下的统一裂纹起裂机制。
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