A Novel Layer Shaping Method to Reduce Far-End Crosstalk Noise in Microstrip Lines using 3D Printer

Abstract

In this paper, a novel layer shaping method to reduce far-end crosstalk (FEXT) noise in multiple microstrip lines was proposed. To reduce FEXT noise induced in adjacent microstrip lines, mushroom-shaped dielectric structure (MSDS) was created between the microstrip lines. The prototypes were fabricated using 3D printer to avoid increased complexity, and the effect of the proposed MSDS was verifiedfrom simulated and measured results.