Packaging technologies for highly integrated 77 GHz automotive radar sensors

Abstract

The availability of SiGe with transit frequencies exceeding 200 GHz enables highly integrated and cost effective 77 GHz radar sensors for automotive applications. A major challenge for future radar generations is the development of an appropriate packaging technology. We propose a system in package approach (SIP) utilizing a SMD package without external 77 GHz connections. Beamforming is possible with dielectric lenses permitting the use of this modular concept in different automotive applications.