Zhenhua Chen, Yu Bing, Yong Zhou, F. Wan, Junxiang Ge
{"title":"75–110 GHz integrated active sextupler module","authors":"Zhenhua Chen, Yu Bing, Yong Zhou, F. Wan, Junxiang Ge","doi":"10.1109/IEEE-IWS.2015.7164585","DOIUrl":null,"url":null,"abstract":"An integrated active sextupler module covering 75-110 GHz is developed and described in this paper. Discrete Schottky devices, commercial MMICs and self-designed passive circuits are included in this module. Multi-chip packaging technology is adopted to greatly simplify inter-stage interconnection, so the characteristics of compact and high reliability are achieved. In the aspect of circuit topology, considering the performance of each device and circuit, an technical route of frequency multiplying - pre-amplifying - power dividing - driving amplifying - frequency multiplying - power amplifying - power combining is chosen. Inconsistency between the final-stage PA MMICs is solved. Finally, the following results have been achieved: while pumped with 0 dBm input signal in the range of 12.5-18.4 GHz, output signal with a typical power of 14 dBm can be produced over the 75-110 GHz band. This performance is comparable to the foreign commercial products.","PeriodicalId":164534,"journal":{"name":"2015 IEEE International Wireless Symposium (IWS 2015)","volume":"5 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-07-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 IEEE International Wireless Symposium (IWS 2015)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEEE-IWS.2015.7164585","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
An integrated active sextupler module covering 75-110 GHz is developed and described in this paper. Discrete Schottky devices, commercial MMICs and self-designed passive circuits are included in this module. Multi-chip packaging technology is adopted to greatly simplify inter-stage interconnection, so the characteristics of compact and high reliability are achieved. In the aspect of circuit topology, considering the performance of each device and circuit, an technical route of frequency multiplying - pre-amplifying - power dividing - driving amplifying - frequency multiplying - power amplifying - power combining is chosen. Inconsistency between the final-stage PA MMICs is solved. Finally, the following results have been achieved: while pumped with 0 dBm input signal in the range of 12.5-18.4 GHz, output signal with a typical power of 14 dBm can be produced over the 75-110 GHz band. This performance is comparable to the foreign commercial products.