Thermo-mechanical analysis of MEMS pressure sensor die-attach for high temperature applications

Abstract

The thermomechanical stress generated by the mismatch of the coefficients of thermal expansion (CTE) of the sensor base material (SiC) and the packaging has a significant impact on the reliability of the packaged sensor. In the current work, non-linear finite element analysis was performed to determine the peeling, shear stresses and the von Mises stresses, in the SiC pressure sensor and the die attach which is intended for high temperature operation. A parametric study has been conducted to study the effects of the substrate material and reference (stress-free) temperature.