Effect of interlayer material on the spreading performance and microstructure of diffusion brazd IC10 superalloy

Qi Li, Ming Xiong, Fengmei Liu, X. Yue, Likun Li, Haitao Gao, Y. Yi
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引用次数: 0

Abstract

The diffusion brazd test of IC10 superalloy was carried out by using Russia solder M4 interlayer powder. The wetting quality of the high-temperature alloy was evaluated by the contact angle of wetting at various temperatures. The result shows that at the temperature of 1250°C, the contact angles of interlayer powder M4 alloy do not exceed 10°, it has high wettability and spreadability over the surface of the IC10 alloy. The structure of the joints has a smooth transition from the base metal to the soldered joint when the interlayer powder M4 was used. In the structure of the joint, the base metal contains a large number of Ɣ '- phases. The microstructure of the weld metal does not have continuous eutectic layers, but includes carbide carboride and other phases when the interlayer powder M4 was used.
层间材料对扩散钎焊IC10高温合金扩散性能和显微组织的影响
采用俄罗斯焊料M4层间粉对IC10高温合金进行了扩散钎焊试验。通过不同温度下的润湿接触角来评价高温合金的润湿质量。结果表明:在1250℃温度下,层间粉末M4合金的接触角不超过10°,在IC10合金表面具有较高的润湿性和铺展性。使用层间粉末M4时,接头的组织从母材到焊点的过渡平滑。在接头组织中,母材含有大量的Ɣ′相。使用层间粉末M4时,焊缝金属的显微组织不存在连续的共晶层,而是包含碳化物和其他相。
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