Coupling concept in connection with surface preparation

P. Kracinska, S. Patela
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Abstract

The integration of optical interconnections on a printed circuit board (PCB) is challenging, as it should remain compatible with existing PCB manufacturing technology. This integration level requires compatibility with the established manufacturing and assembly processes of the conventional electrical board technology, which is based on laminated FR4-substrates and making use of well-known placement and assembly techniques. Since printed circuit boards will continue to be the most important components of electronic equipment, still the most critical problem of the integration of optical interconnections in PCB is coupling the light in and out of the optical plate. By reason of that, various principles and interconnection architectures for optical beam routing were investigated.
与表面处理有关的耦合概念
在印刷电路板(PCB)上集成光学互连是具有挑战性的,因为它必须与现有的PCB制造技术保持兼容。这种集成水平要求与传统电路板技术的既定制造和组装工艺兼容,传统电路板技术基于层压fr4基板,并利用众所周知的放置和组装技术。由于印刷电路板将继续是电子设备中最重要的部件,因此PCB中光互连集成的最关键问题仍然是光进出光板的耦合。因此,本文对光束路由的各种原理和互连结构进行了研究。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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