{"title":"SEREEL2 – making laser single-event effects testing available to the many","authors":"R. Sharp, J. Gow","doi":"10.1109/BICOP.2018.8658358","DOIUrl":null,"url":null,"abstract":"This paper describes the phenomenon of single-event effects caused by the passage of a high energy particle through the silicon die of a semiconductor device. It goes on to outline the significance of these effects and the situations in which single-event effects can occur, followed by a summary of current testing and characterisation practices for determining the sensitivity of components to such events. Finally, the use of a relatively new technique for SEE testing, employing a pulsed laser, is introduced and examples quoted where such a technique has delivered benefits compared to more established methods. Laser testing promises to deliver much faster and lower cost results, opening up access to SEE testing to a wider range of users than is currently the case.","PeriodicalId":145258,"journal":{"name":"2018 IEEE British and Irish Conference on Optics and Photonics (BICOP)","volume":"42 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 IEEE British and Irish Conference on Optics and Photonics (BICOP)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/BICOP.2018.8658358","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
This paper describes the phenomenon of single-event effects caused by the passage of a high energy particle through the silicon die of a semiconductor device. It goes on to outline the significance of these effects and the situations in which single-event effects can occur, followed by a summary of current testing and characterisation practices for determining the sensitivity of components to such events. Finally, the use of a relatively new technique for SEE testing, employing a pulsed laser, is introduced and examples quoted where such a technique has delivered benefits compared to more established methods. Laser testing promises to deliver much faster and lower cost results, opening up access to SEE testing to a wider range of users than is currently the case.