Design and Modeling of a Microwave Plasma Enhanced Chemical Vapor Deposition System at 2.45 GHz

Yilang Jiang, Kaviya Aranganadin, H. Hsu, Ming-Chieh Lin
{"title":"Design and Modeling of a Microwave Plasma Enhanced Chemical Vapor Deposition System at 2.45 GHz","authors":"Yilang Jiang, Kaviya Aranganadin, H. Hsu, Ming-Chieh Lin","doi":"10.1109/IVEC45766.2020.9520464","DOIUrl":null,"url":null,"abstract":"Solid thin films developed by a microwave plasma-enhanced chemical vapor deposition (MPECVD) system have excellent electrical properties, good substrate adhesion, and excellent step coverage. Due to these advantages, MPECVD films have been widely used in very large-scale integrated circuit technology, optoelectronic devices, MEMS, and other fields. The MPECVD method is one of the promising candidates for synthetic CNTs due to low temperature and large area growth. Recently, this technique has gained popularity in graphene and diamond film fabrication. This paper discusses the design of an MPECVD chamber operated at 2.45 GHz of frequency using a finite element method simulation. The design consists of a coaxial waveguide and a cylindrical chamber at the center connected using 4 identical slots in each direction. For the magnetic coupling, slots placed at the bottom of the central cavity. TM011 mode in the inner chamber is employed to generate the plasma at 2.45GHz. In addition, we consider the effects of input power and gas pressure on plasma density.","PeriodicalId":170853,"journal":{"name":"2020 IEEE 21st International Conference on Vacuum Electronics (IVEC)","volume":"178 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-10-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 IEEE 21st International Conference on Vacuum Electronics (IVEC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IVEC45766.2020.9520464","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

Abstract

Solid thin films developed by a microwave plasma-enhanced chemical vapor deposition (MPECVD) system have excellent electrical properties, good substrate adhesion, and excellent step coverage. Due to these advantages, MPECVD films have been widely used in very large-scale integrated circuit technology, optoelectronic devices, MEMS, and other fields. The MPECVD method is one of the promising candidates for synthetic CNTs due to low temperature and large area growth. Recently, this technique has gained popularity in graphene and diamond film fabrication. This paper discusses the design of an MPECVD chamber operated at 2.45 GHz of frequency using a finite element method simulation. The design consists of a coaxial waveguide and a cylindrical chamber at the center connected using 4 identical slots in each direction. For the magnetic coupling, slots placed at the bottom of the central cavity. TM011 mode in the inner chamber is employed to generate the plasma at 2.45GHz. In addition, we consider the effects of input power and gas pressure on plasma density.
2.45 GHz微波等离子体增强化学气相沉积系统的设计与建模
微波等离子体增强化学气相沉积(MPECVD)系统制备的固体薄膜具有优异的电学性能、良好的衬底附着力和良好的台阶覆盖度。由于这些优点,MPECVD薄膜已广泛应用于超大规模集成电路技术、光电器件、MEMS等领域。由于低温和大面积生长的特点,MPECVD方法是一种很有前途的合成碳纳米管的方法。最近,该技术在石墨烯和金刚石薄膜制造中得到了广泛应用。本文采用有限元仿真方法对工作在2.45 GHz频率下的MPECVD腔室进行了设计。该设计由同轴波导和中心的圆柱形腔室组成,每个方向上使用4个相同的槽连接。对于磁力联轴器,槽放置在中心腔的底部。采用内腔TM011模式产生2.45GHz的等离子体。此外,我们考虑了输入功率和气体压力对等离子体密度的影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信