Experimental characterization of copper/low-k transmission line interconnects through microwave measurements

Abstract

In this paper, we present the results of microwave measurements of copper/low-k transmission line interconnects. From measured S-parameters, the extracted R, L, and C for copper/low-k transmission lines are presented. In addition, the relative dielectric constant and loss tangent for various dielectric materials (SiO/sub 2/, low-k2 (Novellus Coral low-k dielectric), and low-k1 (JSR Corp. low-k dielectric)) up to 40 GHz are given.