R. Wang, P. Ning, D. Boroyevich, M. Danilović, Fred Wang, R. Kaushik
{"title":"Design of high-temperature SiC three-phase AC-DC converter for >100°C ambient temperature","authors":"R. Wang, P. Ning, D. Boroyevich, M. Danilović, Fred Wang, R. Kaushik","doi":"10.1109/ECCE.2010.5617813","DOIUrl":null,"url":null,"abstract":"High temperature (HT) converters have become more and more important in industrial applications where the converters will operate in a harsh environment. These environments require the converter to have not only high-temperature semiconductor devices (SiC, GaN) but also high-temperature control electronics. This paper describes a design process for a three-phase PWM rectifier. The SiC JFET planar structure is used for the main semiconductor devices. Other high-temperature components, including the passive components, silicon-on-insulator chips and the auxiliary components are studied and summarized. Finally, a 1.4 kW lab prototype is fabricated and tested for verification.","PeriodicalId":161915,"journal":{"name":"2010 IEEE Energy Conversion Congress and Exposition","volume":"5 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2010-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"30","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2010 IEEE Energy Conversion Congress and Exposition","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECCE.2010.5617813","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 30
Abstract
High temperature (HT) converters have become more and more important in industrial applications where the converters will operate in a harsh environment. These environments require the converter to have not only high-temperature semiconductor devices (SiC, GaN) but also high-temperature control electronics. This paper describes a design process for a three-phase PWM rectifier. The SiC JFET planar structure is used for the main semiconductor devices. Other high-temperature components, including the passive components, silicon-on-insulator chips and the auxiliary components are studied and summarized. Finally, a 1.4 kW lab prototype is fabricated and tested for verification.