Ground Plane influence on UTBB SOI nMOSFET analog parameters

V. Itocazu, V. Sonnenberg, E. Simoen, C. Claeys, J. Martino
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引用次数: 5

Abstract

This paper presents an analysis of the Ground Plane (GP) influence on analog parameters of Ultra Thin Body and Buried Oxide (UTBB) SOl nMOSFET devices based on experimental data and simulations results. The presence of a GP improves the transconductance in the saturation region due to the strong coupling between front and back gates. However, the GP worsens the output conductance due to the higher drain electrical field penetration observed by simulation. As a result, the devices without ground plane present better results in intrinsic voltage gain, Early Voltage and Drain Induced Barrier Lowering.
地平面对UTBB SOI nMOSFET模拟参数的影响
基于实验数据和仿真结果,分析了地平面(GP)对超薄体和埋地氧化物(UTBB)溶胶nMOSFET器件模拟参数的影响。由于前后栅极之间的强耦合,GP的存在改善了饱和区的跨导性。然而,由于模拟观察到较高的漏极电场穿透,GP使输出电导恶化。结果表明,无地平面器件在本征电压增益、早期电压和漏极感应势垒降低方面表现出较好的效果。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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