Thermoelectric properties and structures of the sintered compact of Cu:Sn:S = 8:1:4 composition

Abstract

The compact of Cu:Sn:S=8:1:4 composition was prepared by sintering. The thermoelectric properties of the compact were measured as a function of temperature and annealing period. The microstructures were investigated by X-ray diffraction experiments and transmission electron microscopic observation. The compact is desirable in thermoelectric properties and thermal stability below 450 K. The compact consists of mixtures of several compound structures.