Package-Aware Scheduling of embedded workloads for temperature and Energy management on heterogeneous MPSoCs

Shervin Sharifi, T. Simunic
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引用次数: 7

Abstract

In this paper, we present PASTEMP, a solution for Package Aware Scheduling for Thermal and Energy management using Multi- Parametric programming in heterogeneous embedded multiprocessor SoCs (MPSoCs). Based on the current thermal state of the system and current performance requirements of the workload, PASTEMP finds thermally safe and energy efficient voltage/frequency configurations for the cores on a MPSoC. The tasks are assigned to the cores depending on their performance demand and the current voltage/frequency of the core. The voltage/frequency settings of the cores are chosen through an optimization process which is based on the instantaneous thermal model we introduce to decouple the effect of package temperature from the temperature changes caused by the power consumption of the cores. To be able to find the best voltage/frequency settings at runtime, we use multi-parametric programming to separate the optimization into offline and online phases. According to our experimental results, compared to similar DTM techniques, PASTEMP results in up to 23% energy saving and 26% throughput improvement and reduces the deadline misses to more than a half while meeting all thermal constraints.
异构mpsoc温度和能量管理中嵌入式工作负载的包感知调度
本文提出了一种在异构嵌入式多处理器soc (mpsoc)中使用多参数规划实现热能量管理的封装感知调度的解决方案PASTEMP。根据系统当前的热状态和工作负载的当前性能要求,PASTEMP为MPSoC上的核心找到了热安全和节能的电压/频率配置。任务分配给核心取决于他们的性能需求和核心的电流电压/频率。通过基于瞬时热模型的优化过程来选择核心的电压/频率设置,从而将封装温度的影响与核心功耗引起的温度变化解耦。为了能够在运行时找到最佳电压/频率设置,我们使用多参数编程将优化分为离线和在线阶段。根据我们的实验结果,与类似的DTM技术相比,PASTEMP可节省高达23%的能源,提高26%的吞吐量,并在满足所有热约束的情况下将截止日期减少一半以上。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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