Plasma-polymerized organosilicon films for use in electronic circuit technology

Conference on Electrical Insulation & Dielectric Phenomena - Annual Report 1982 Pub Date : 1982-10-01 DOI:10.1109/CEIDP.1982.7726525

E. Sacher, J. Klemberg-Sapieha, H. Schreiber, M. Wertheimer

引用次数: 0

Abstract

Plasma techniques have become widely accepted in the semiconductor industry for a range of applications. These can conveniently be divided into two broad categories, namely 1. plasma deposition, and 2. plasma etching.

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用于电子电路技术的等离子体聚合有机硅薄膜

等离子体技术已在半导体工业中广泛应用。这些可以方便地分为两大类，即1。2.等离子沉积;等离子蚀刻。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Conference on Electrical Insulation & Dielectric Phenomena - Annual Report 1982

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