Mechanical properties of Sn-3.5Ag-0.5La lead-free solder alloy for green electronics

2021 Seventh International Conference on Aerospace Science and Engineering (ICASE) Pub Date : 2021-12-14 DOI:10.1109/ICASE54940.2021.9904081

Fahad Sagheer, M. Aamir, M. Sadiq

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Abstract

Eutectic Tin-Lead solder, commonly 63Sn-37Pb, has been used for times in the electronic industry. However, due to the harmful effects of lead on the environment, many alternatives have been investigated. The Tin-Silver alloys are acknowledged on a large scale as a replacement for traditional Tin-Lead solders due to their excellent mechanical properties. However, to further enhance the properties of Tin-Silver alloys, doping of additional elements is highly acknowledged. In this study, the investigation on the mechanical properties of Sn-3.5Ag solder alloy is carried out after doping 0.5 wt% Lanthanum. The yield strength (YS), ultimate tensile strength (UTS), creep behaviour and hardness are evaluated using tensile tests, creep tests and Brinell hardness measurement, respectively. The composition of alloys is confirmed using energy dispersive spectroscopy, and phase analysis is done by X-ray diffraction. The results showed a significant increase in all mechanical properties after adding Lanthanum into the Tin- Silver alloy.

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绿色电子用Sn-3.5Ag-0.5La无铅钎料合金的力学性能

共晶锡铅焊料，通常为63Sn-37Pb，在电子工业中已多次使用。然而，由于铅对环境的有害影响，人们研究了许多替代方法。锡银合金因其优异的机械性能而被广泛认为是传统锡铅焊料的替代品。然而，为了进一步提高锡银合金的性能，人们高度认可掺杂额外的元素。本研究对Sn-3.5Ag钎料合金中掺杂0.5 wt%镧后的力学性能进行了研究。分别通过拉伸试验、蠕变试验和布氏硬度测量来评估屈服强度(YS)、极限抗拉强度(UTS)、蠕变行为和硬度。用能量色散谱法确定了合金的成分，并用x射线衍射进行了物相分析。结果表明，加入镧后，锡银合金的各项力学性能均有显著提高。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

2021 Seventh International Conference on Aerospace Science and Engineering (ICASE)

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