Automated Dual-probing System for Wafer-level Testing Based on the Integration of Visual Identification and Laser Sensing

Ya-Ting Huang, Rongshun Chen
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Abstract

This study develops an automated wafer-level testing system, using visual and laser as the sensing devices, which can be the platform of MEMS measurement at wafer level. The proposed system involves the development of human-machine interface and precisely positioning control, which includes camera module for visual identification, motorized micro positioners, laser sensors for probe positioning automated, and wafer movable stage for the wafer positioning.
基于视觉识别与激光传感集成的晶圆级自动双探测系统
本研究开发了一套以视觉和激光为传感元件的MEMS晶圆级自动化测试系统,可作为MEMS晶圆级测量的平台。该系统涉及人机界面和精确定位控制的开发,包括用于视觉识别的摄像头模块、用于自动定位的微动定位器、用于探针定位的激光传感器和用于晶圆定位的晶圆移动平台。
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