Assessment of 10 nm Tunnel- FETs and FinFETs transistors for ultra-low voltage and high-speed digital circuits

Mateo Rendón, Christian Cao, Kevin Landázuri, L. Prócel, L. Trojman, R. Taco
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Abstract

The trade-offs of the Tunnel-FETs (TFETs) in terms of delay, energy per cycle, and noise margin are compared with 10 nm FinFETs for a wide voltage supply ranging from 200 to 600 mV with a specific focus on the ultra-low voltage domain. A calibration process is carried out to ensure the same off-current and extrinsic capacitance in both devices. The TFETs presented a high advantage in terms of delay as well as a penalty in energy consumed. As a result, the TFET circuits show a better Energy-Delay trade-off in voltages as low as 350 m V. This is explained by a larger capacitance caused by the nature of the intrinsic materials chosen of the device modelling.
用于超低电压和高速数字电路的10nm隧道场效应管和finfet晶体管的评估
在200至600 mV的宽电压供应下,将隧道场效应管(tfet)在延迟、每周期能量和噪声裕度方面的权衡与10 nm finfet进行比较,并特别关注超低电压域。进行了校准过程,以确保两个器件具有相同的断开电流和外部电容。tfet在延迟和能量消耗方面具有很高的优势。因此,在低至350m v的电压下,ttfet电路表现出更好的能量延迟权衡,这是由器件建模所选择的固有材料的性质引起的较大电容所解释的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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