Pad printer

Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium Pub Date : 1900-01-01 DOI:10.1109/IEMT.1996.559721

G. Love, G. Maher, N. Long

引用次数: 0

Abstract

We present the results of alpha-site testing of a pad printer for thick film technology, including uniformity, reproducibility, physical and electrical characterization of conductor and resistor patterns in single-layer (hybrid) configurations and in multi-layer co-fired designs.

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垫打印机

我们介绍了厚膜技术移印机的alpha-site测试结果，包括单层(混合)配置和多层共烧设计中导体和电阻模式的均匀性、可重复性、物理和电气特性。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium

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