Manipulating Bubble Dynamics and Heat Transfer using 3D Superbiphilic Micro/Nanostructures

Christopher Salmean, H. Qiu
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Abstract

- With the development and miniaturization of high density integrated circuits and multi-functions of electronic chips, the heat flux generated by the chips has been greatly increased, which becomes a bottleneck for further development. Therefore, it is emergent to develop new and efficient thermal management techniques for electronics cooling. Phase change heat transfer, such as boiling and evaporation, is a promising technique for the cooling of electronic devices. However, the prevention of vapor film formation is a fundamental challenge for the enhancement of phase change systems, and an impetus therefore exists for the discovery of new techniques to segregate nucleation during their formation. It has been shown that the surface of the three-dimensional superbiphilic wettability patterns can control the bubble dynamics and phase transition process of the three-phase contact line, thereby greatly enhancing the heat transfer coefficient and critical heat flux of pool boiling and flow boiling with a range of geometries, orientations and morphologies in order to influence the surface-tension forces which resist the bubble’s departure and wicking performance. Previous study also found that the concentration Marangoni effect using low-boiling-point multi-component working fluids may help further improve heat transfer performance. Therefore, it is of great interests to study the multiphase flow, wicking performance, heat and mass transfer and contact line dynamics on the three-dimensional superbiphilic wettability patterned surfaces. This talk will present our recently progresses in novel three-dimensional superbiphilic wettability patterns for enhancing phase change heat transfer and how to manipulate the liquid propagation coefficient using non-uniform micropillar array. The experimental results utilizing high speed visualization and time-resolved PIV systems will be presented.
利用三维超亲微/纳米结构操纵气泡动力学和传热
-随着高密度集成电路的发展和小型化以及电子芯片的多功能化,芯片产生的热流密度大大增加,成为进一步发展的瓶颈。因此,开发新的高效的电子冷却热管理技术势在必行。相变传热,如沸腾和蒸发,是一种很有前途的电子设备冷却技术。然而,防止气膜的形成是增强相变系统的一个基本挑战,因此存在着发现新技术以在其形成过程中分离成核的动力。研究表明,三维超亲润湿性图案的表面可以控制气泡动力学和三相接触线的相变过程,从而大大提高各种几何、取向和形态的池沸和流沸的传热系数和临界热流密度,从而影响阻碍气泡离开和排芯性能的表面张力。前人的研究还发现,低沸点多组分工质的浓度马兰戈尼效应可能有助于进一步提高传热性能。因此,研究三维超亲润湿性表面的多相流动、吸湿性能、传热传质和接触线动力学具有重要意义。本讲座将介绍我们在增强相变传热的新型三维超亲润湿性模式方面的最新进展,以及如何使用非均匀微柱阵列控制液体传播系数。将介绍利用高速可视化和时间分辨PIV系统的实验结果。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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