Glass Interposer for High-Density Photonic Packaging

2022 Optical Fiber Communications Conference and Exhibition (OFC) Pub Date : 2022-03-01 DOI:10.1364/ofc.2022.tu3a.3

L. Brusberg, Jason R. Grenier, S. E. Kocabas, A. Zakharian, L. Yeary, Daniel W. Levesque, Barry J. Paddock, R. Bellman, Robin M. Force, Chad C. Terwilliger, Clifford G. Sutton, Jeffrey S. Clark, Katerina Rousseva

引用次数: 3

Abstract

A circuit on glass with optical fiber interfaces, integrated planar waveguides, and through glass vias is demonstrated for co-packaged optics hosting and interconnecting electrical and photonic integrated circuits by flip-chip bonding.

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用于高密度光子封装的玻璃中间体

介绍了一种具有光纤接口、集成平面波导和玻璃通孔的玻璃电路，该电路通过倒装键合实现了光电集成电路和光子集成电路的共封装。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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2022 Optical Fiber Communications Conference and Exhibition (OFC)

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