Structure-aware Thermal Model reduction

Abstract

This paper introduces a methodology to generate Compact Thermal Models (CTMs) of electronic systems based on the knowledge of structure eigenvalues in 3D distributed thermal models. Initially, the influence of various model parameters on its eigenvalues is demonstrated using the Green's function solution of the model. Next, CTMs in the form of RC ladders are generated for a real test hybrid circuit with different values of dissipated power and in various cooling conditions. Then, the simulation results produced by these models are compared with the ones obtained using the distributed model and the measured values.