Adhesive layer effect on gold-silica thin film interfaces for surface plasmon resonance modeling

P. Jahanshahi, M. Ghomeishi, F. R. M. Adikan
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引用次数: 6

Abstract

For years the so called method surface plasmon resonance (SPR) and its application in biomedical and sensors is in the attraction point of theoretical and experimental scientist. However, the practical structure of this technique is usually different with the ones in the modeling. The simplified dielectric-metal-dielectric is been using in the modeling instead the practical dielectric-adhesive-metal-dielectric and definitely the effect of this extra adhesive layer is always eliminated. In this paper we prove that adhesive layer in the structure will affect the results. The decrease of the magnetic intensity in TM mode for the SPR is the proof for this hypothesis. For this purpose we have done mode analysis of the SPR structure for both simple and practical structures using COMSOL Multiphysics.
表面等离子体共振模型中金-硅薄膜界面的粘接层效应
近年来,表面等离子体共振(SPR)方法及其在生物医学和传感器中的应用一直是理论界和实验界关注的热点。然而,该技术的实际结构通常与建模中的结构不同。采用简化的介电-金属-介电模型代替实际的介电-粘接-金属-介电模型,并明确地消除了这一额外粘接层的影响。本文证明了结构中粘接层对结果的影响。SPR在TM模式下磁场强度的减小证明了这一假设。为此,我们使用COMSOL Multiphysics对SPR结构进行了简单和实际结构的模态分析。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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