On tests to detect via opens in digital CMOS circuits

S. Reddy, I. Pomeranz, Chen Liu
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引用次数: 16

Abstract

We consider voltage based (logic) tests to detect complete opens in digital CMOS circuits. Open defects are known to be prevalent in the current VLSI technologies and vias are known to be the primary sites of interconnect opens. The voltage on a circuit node that is disconnected due to an open via is determined by several circuit parameters. As the feature size of VLSI circuits decreases, precise knowledge of the values of circuit parameters may be difficult, if not impossible, to obtain. Thus, it is important to develop methods to generate tests to detect opens that do not require accurate knowledge of circuit parameters. We propose new classes of tests to detect via opens with voltage based (logic) tests that are effective even with imprecise knowledge of circuit parameters. The proposed tests to detect an open via are constituted as a pair of constrained stuck-at fault tests for the circuit node affected by the open defect. One class of proposed tests called circuit parameter independent tests detect via opens even in the case of complete lack of knowledge of the circuit parameters. Experimental results demonstrate that high coverage of open vias can be obtained using the proposed constrained tests.
在数字CMOS电路中检测通孔的测试
我们考虑基于电压的(逻辑)测试来检测数字CMOS电路中的完全开路。众所周知,开放缺陷在当前的VLSI技术中非常普遍,而过孔是互连开放的主要位置。由于开孔而断开的电路节点上的电压由几个电路参数决定。随着VLSI电路特征尺寸的减小,电路参数值的精确知识可能很难获得,如果不是不可能的话。因此,开发不需要精确了解电路参数的方法来生成检测开路的测试是很重要的。我们提出了新的测试类别,通过基于电压的(逻辑)测试来检测,即使在不精确的电路参数知识下也有效。所提出的通孔检测方法是由一对受通孔影响的电路节点的受限卡滞故障检测组成的。一类被提议的测试称为电路参数独立测试,即使在完全不知道电路参数的情况下也可以通过打开进行检测。实验结果表明,所提出的约束测试方法可以获得较高的开孔覆盖率。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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