High-performance microprocessor packaging in the year 2000: technical and economic barriers and alternatives

Abstract

By the year 2000, computers capable of >1000 MIPs and operating at >500 MHz are on the horizon. As the microprocessor becomes more powerful, major technical and economic challenges in packaging technologies are evident. In this paper, we trace the emergence of the microprocessor by examining the technical and economical drivers. It is seen that specialized material processes and designs are required to package a high-performance microprocessor. Low-cost materials with low dielectric constant and high electrical and thermal conductivity metallization are required to meet these objectives. As microprocessor architectures migrate towards closely-coupled CPU/cache requiring more than one VLSI, the multichip module is emerging/re-emerging as a requirement.