Investigation of inter and intra chip wireless channel modelling

Abstract

Development in communication and VLSI technology has made world small and handy. The wired interconnect have reached its fundamental material limits and wireless communication has been used to interconnect components on printed circuit board and even within the integrated chip. Channel modelling is an important aspect in any wireless communication. When communication happens in near field and in between chips or within the chips, much electromagnetic interference can occur which arises because of the material used to construct the devices and types of signals used for the transmission. This paper investigates channel modelling devised by different researchers and the parameters considered while modelling the channel for inter and intra chip wireless communication. It is recognized that, ray tracing and electromagnetic channel modelling with some of the channel parameters like path loss, dispersion, power decay rate, channel impulse response etc. can be used in modelling the channel.