Bipolar transistor gain influence on the high temperature thermal stability of HV-BiGTs

L. Storasta, S. Matthias, A. Kopta, Munaf T. A. Rahimo
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引用次数: 13

Abstract

In this paper we present the detailed investigation of the influence of the internal bipolar PNP transistor gain on the thermal stability of high voltage IGBTs and BiGTs. The bipolar gain is controlled by means of anode and buffer design and by the introduction of anode shorts. The influence of the different buffer and anode doping profiles and the different layouts in the case of anode-shorted designs are analyzed. Temperature dependent leakage current measurements confirm that the lowering of the leakage current and its subsequent weak temperature dependency can be achieved by buffer and anode engineering albeit with certain design trade-off restrictions. Nevertheless, another effective approach for suppressing the leakage current and its dependency on temperature is achieved by the introduction of anode shorts as demonstrated in reverse conducting IGBT or BiGT structures. Such designs eliminate to a large extent the internal bipolar transistor action in the BiGT anode shorted designs while allowing different anode and buffer doping profiles for the design trade-offs. Despite the fact that the lifetime control in the BiGT drift region causes the leakage current to increase, the temperature coefficient remains unchanged, hence, making the hard switched BiGT suitable for high temperature operation.
双极晶体管增益对高压bigt高温热稳定性的影响
本文详细研究了内双极PNP晶体管增益对高压igbt和bigt热稳定性的影响。通过阳极和缓冲器的设计以及引入阳极短路来控制双极增益。分析了在阳极短路的情况下,不同的缓冲液和阳极掺杂分布以及不同的布局对阳极短路设计的影响。温度相关的泄漏电流测量证实,尽管存在一定的设计权衡限制,但缓冲和阳极工程可以实现泄漏电流的降低及其随后的弱温度依赖性。然而,另一种有效的方法是通过引入阳极短路来抑制泄漏电流及其对温度的依赖,如反向导电IGBT或BiGT结构所示。这样的设计在很大程度上消除了BiGT阳极短路设计中的内部双极晶体管作用,同时允许不同的阳极和缓冲掺杂配置文件进行设计权衡。尽管BiGT漂移区的寿命控制使漏电流增大,但温度系数保持不变,因此硬开关BiGT适合高温工作。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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