Plasma mode influences on the surface hydrophobization of polyimide

Abstract

Polyimide (PI) based photo-resistance films were treated by different CF4 plasma modes to serve as a bank material for inkjet printing OLED. The original PI film shows a moderate hydrophobicity with a 23.8° contact angle for PGMEA. However, the surface of PI film will become hydrophobic after treated by CF4 plasma with PE mode. In contrast, CF4 plasma with etch mode is apt to form a hydrophilic PI surface because of the ion bombardment.