Comparison between optimization techniques for Y-junction devices in SOI substrates

Roy R. Prosopio-Galarza, Juan M. De la Cruz-Coronado, H. Hernández-Figueroa, Ruth E. Rubio-Noriega
{"title":"Comparison between optimization techniques for Y-junction devices in SOI substrates","authors":"Roy R. Prosopio-Galarza, Juan M. De la Cruz-Coronado, H. Hernández-Figueroa, Ruth E. Rubio-Noriega","doi":"10.1109/INTERCON.2019.8853569","DOIUrl":null,"url":null,"abstract":"We report the comparison between three optimization methods used for the design of Y-junction in terms of convergence velocity, maximum transmitted power and fabrication feasibility. The optimization techniques include Particle Swarm Optimization, Shrinking Box algorithm and Steepest Ascent algorithm. we demonstrate transmittance values of 49% in the case of the splitter and near 96% in the case of the combiner with areas on chip down to 2.05 μm2. The practical application of this work is to design compact, low-loss and wavelength independent splitters and combiners for sub-micron silicon-on-insulator(SOI) photonic integrated circuits, compatible with typical commercial standard microfabrication processes.","PeriodicalId":214397,"journal":{"name":"2019 IEEE XXVI International Conference on Electronics, Electrical Engineering and Computing (INTERCON)","volume":"29 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 IEEE XXVI International Conference on Electronics, Electrical Engineering and Computing (INTERCON)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/INTERCON.2019.8853569","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

Abstract

We report the comparison between three optimization methods used for the design of Y-junction in terms of convergence velocity, maximum transmitted power and fabrication feasibility. The optimization techniques include Particle Swarm Optimization, Shrinking Box algorithm and Steepest Ascent algorithm. we demonstrate transmittance values of 49% in the case of the splitter and near 96% in the case of the combiner with areas on chip down to 2.05 μm2. The practical application of this work is to design compact, low-loss and wavelength independent splitters and combiners for sub-micron silicon-on-insulator(SOI) photonic integrated circuits, compatible with typical commercial standard microfabrication processes.
SOI衬底中y结器件的优化技术比较
本文从收敛速度、最大传输功率和制造可行性等方面比较了用于y型结设计的三种优化方法。优化技术包括粒子群算法、收缩盒算法和最陡上升算法。我们证明了分路器的透光率为49%,合流器的透光率接近96%,片上面积降至2.05 μm2。这项工作的实际应用是为亚微米绝缘体上硅(SOI)光子集成电路设计紧凑、低损耗和波长无关的分路器和合成器,与典型的商业标准微加工工艺兼容。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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