J. Slaughter, K. Nagel, R. Whig, S. Deshpande, S. Aggarwal, M. Deherrera, J. Janesky, M. Lin, H. Chia, M. Hossain, S. Ikegawa, F. Mancoff, G. Shimon, J. Sun, M. Tran, T. Andre, S. Alam, F. Poh, J. Lee, Y. Chow, Y. Jiang, H. Liu, C. Wang, S. Noh, T. Tahmasebi, S. Ye, D. Shum
{"title":"Technology for reliable spin-torque MRAM products","authors":"J. Slaughter, K. Nagel, R. Whig, S. Deshpande, S. Aggarwal, M. Deherrera, J. Janesky, M. Lin, H. Chia, M. Hossain, S. Ikegawa, F. Mancoff, G. Shimon, J. Sun, M. Tran, T. Andre, S. Alam, F. Poh, J. Lee, Y. Chow, Y. Jiang, H. Liu, C. Wang, S. Noh, T. Tahmasebi, S. Ye, D. Shum","doi":"10.1109/IEDM.2016.7838467","DOIUrl":null,"url":null,"abstract":"In this paper we present an overview of important features for reliable and manufacturable ST-MRAM as well as new results in two areas: pMTJ arrays with data retention sufficient for programming before 260°C wave solder, and performance of a 256Mb, DDR3 ST-MRAM product chip.","PeriodicalId":186544,"journal":{"name":"2016 IEEE International Electron Devices Meeting (IEDM)","volume":"9 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"20","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE International Electron Devices Meeting (IEDM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEDM.2016.7838467","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 20
Abstract
In this paper we present an overview of important features for reliable and manufacturable ST-MRAM as well as new results in two areas: pMTJ arrays with data retention sufficient for programming before 260°C wave solder, and performance of a 256Mb, DDR3 ST-MRAM product chip.