High performance GaN single-chip frontend for compact X-band AESA systems

P. Schuh, H. Sledzik, R. Reber
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引用次数: 8

Abstract

A next generation of AESA antennas will be challenged with the need for lower size, weight, power and cost (SWAP-C). This leads to enhanced demands especially with regard to the integration density of the RF-part inside a T/R module. The semiconductor material GaN has proven its capacity for high power amplifiers, robust receive components as well as switch components for separation of transmit and receive mode. This paper will describe the design and measurement results of a GaN-based single-chip T/R module frontend (HPA, LNA and SPDT) using UMS GH25 technology and covering the frequency range from 8 GHz to 12 GHz. Key performance parameters of the frontend are 13 W minimum transmit (TX) output power over the whole frequency range with peak power up to 17 W. The frontend in receive (RX) mode has a noise figure below 3.2 dB over the whole frequency range, and can survive more than 5 W input power. The large signal insertion loss of the used SPDT is below 0.9 dB at 43 dBm input power level.
用于紧凑型x波段AESA系统的高性能GaN单芯片前端
下一代AESA天线将面临更小尺寸、更轻重量、更低功耗和更低成本(SWAP-C)的挑战。这导致了更高的要求,特别是在T/R模块内射频部分的集成密度方面。半导体材料GaN已经证明了其用于高功率放大器,鲁棒接收元件以及用于发射和接收模式分离的开关元件的能力。本文将描述一种基于gan的单芯片T/R模块前端(HPA, LNA和SPDT)的设计和测量结果,该前端采用umsgh25技术,覆盖频率范围为8 GHz至12 GHz。前端的关键性能参数是整个频率范围内的最小发射(TX)输出功率为13w,峰值功率可达17w。接收(RX)模式的前端在整个频率范围内的噪声系数低于3.2 dB,并且可以承受大于5w的输入功率。在43 dBm输入功率下,SPDT的大信号插入损耗低于0.9 dB。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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