Modeling the thermal performance of a packaged MEMS thermal sensor at wide pressure range for IoT applications

Abstract

This paper focuses on the thermal performance of a wafer level packaged MEMS thermal sensor, where the pressure varies between deep vacuum (0.1 Pa) and atmospheric pressure. The simulations are based on commercial software and are corroborated by modeling and measurements. There is a good agreement between the measured experimental data for the thermal time constant and the modeling and simulations.