A low cost COTS-based microwave packaging methodology

52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) Pub Date : 2002-08-07 DOI:10.1109/ECTC.2002.1008238

W. Kritzler, P. Bronecke, P. Kraft, G. Yan

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引用次数: 1

Abstract

Lockheed Martin Naval Electronics & Surveillance Systems - Surface Systems (LM NE&SS-SS) developed a unique multichip module (MCM) packaging system designed to support low cost manufacturing of electronics for advanced defense and commercial applications. This technology, plastic chip-on-flex (PCOF), is based on the baseline high density interconnect (HDI) technology, invented by General Electric Aerospace (now Lockheed Martin) and perfected as a result of on-going collaboration between Lockheed Martin (LM) and GE. The Lockheed Martin PCOF technology is a key element in reducing costs of microelectronic modules. The HDI interconnect structure is rugged (no wirebonds) and can be designed with controlled impedance transmission lines for sensitive RF interconnections. HDI technology makes it possible to design and manufacture microelectronic modules which are smaller, lighter weight, highly integrated, highly reliable, with predictable/reproducible electrical performance. This paper emphasises several novel aspects of the technology. Benefits include reduced manufacturing cost, increased reliability, and reduced module size and weight.

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一种低成本的基于cots的微波封装方法

洛·马海军电子和监视系统水面系统公司(LM NE&SS-SS)开发了一种独特的多芯片模块(MCM)封装系统，旨在支持先进国防和商业应用电子产品的低成本制造。这种塑料柔性芯片(PCOF)技术基于基线高密度互连(HDI)技术，该技术由通用电气航空航天公司(现为洛克希德·马丁公司)发明，并在洛克希德·马丁公司(LM)和通用电气公司的持续合作下得到完善。洛克希德·马丁公司的PCOF技术是降低微电子模块成本的关键因素。HDI互连结构坚固耐用(没有线键)，可以设计具有控制阻抗的传输线，用于敏感的RF互连。HDI技术使设计和制造更小、重量更轻、高度集成、高度可靠、具有可预测/可重复电气性能的微电子模块成为可能。本文着重介绍了该技术的几个新方面。优点包括降低制造成本，提高可靠性，减小模块尺寸和重量。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)

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