A new method for testing Peltier modules

Abstract

This paper presents the results of the application of a new approach to the study of thermoelectric components. Six single-stage Peltier modules, models TEC1-12706 and TEC1-12706SR, were measured. A pulse-echo contact ultrasonic technique and 10 MHz frequency dual transducer was used to determine thicknesses of ceramic plates at many points of their surfaces. Variation of the results for different modules and plates were obtained. Additional reliability factor was introduced to estimate the temperature deviations as a function of thickness. Comparative results of studied modules can be used for quality selection in the design of electronic components and devices. The proposed ultrasonic method for measuring the thickness of ceramic plates is effective enough to be part of the control and testing procedure.