Intrinsic temperature compensation of highly resistive high-Q silicon microresonators via charge carrier depletion

A. Samarao, F. Ayazi
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引用次数: 10

Abstract

We report on a novel temperature compensation technique that exploits the dependence of TCF on the free charge carriers in silicon bulk acoustic resonators (SiBARs). The free charge carriers are considerably minimized by creating single and multiple pn-junction based depletion regions in the body of the resonator. The TCF of a highly resistive (>1000 Ω-cm) conventional rectangular SiBAR has been reduced from −32 ppm/°C to −3 ppm/°C. We previously exploited the dependence of TCF on silicon resonator geometry for TCF compensation. However, at large charge carrier depletion levels achieved in this work, the TCF is found to become independent of silicon resonator geometry.
高阻高q硅微谐振器的电荷载流子损耗本征温度补偿
我们报道了一种新的温度补偿技术,该技术利用了硅体声谐振器(sibar)中TCF对自由载流子的依赖。通过在谐振器体中创建单个和多个基于pn结的耗尽区,自由电荷载流子大大减少。高电阻(>1000 Ω-cm)传统矩形SiBAR的TCF从- 32 ppm/°C降至- 3 ppm/°C。我们之前利用了TCF对硅谐振器几何形状的依赖来进行TCF补偿。然而,在本工作中实现的大载流子耗尽水平下,发现TCF与硅谐振腔几何形状无关。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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