A compact measurement set-up for envelope-tracking RF PAs with calibrated sensing of baseband V/I at the supply terminal

Julien Couvidat, G. P. Gibiino, G. Pailloncy, M. vanden Bossche, A. Ghiotto, D. Schreurs
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引用次数: 9

Abstract

This paper presents a compact set-up to perform automated measurements of RF PAs under envelope-tracking (ET) operation. In addition to RF signal generation and acquisition, it allows calibrated measurements of the baseband voltage and current at the supply terminal with up to 40 MHz bandwidth, enabling instantaneous efficiency measurements. The presented set-up is used to extract two different shaping tables, and to test ET operation with a 5 MHz WCDMA and a 20 MHz LTE signals at 838 MHz. The used devices are an InGaP/Silicon RF power amplifier (PA) from Skyworks and a high voltage extra fast complementary bipolar (XFCB) power modulator (PM) from Analog Devices.
一种紧凑的测量装置,用于包络跟踪RF PAs,在供电端校准基带V/I感测
本文介绍了一种紧凑的装置,用于在包络跟踪(ET)操作下执行RF PAs的自动测量。除了射频信号的产生和采集,它还可以在高达40 MHz的带宽下对电源终端的基带电压和电流进行校准测量,从而实现瞬时效率测量。所提出的设置用于提取两种不同的整形表,并在838 MHz的5mhz WCDMA和20mhz LTE信号下测试ET操作。所使用的器件是来自Skyworks的InGaP/Silicon RF功率放大器(PA)和来自Analog devices的高压超高速互补双极(XFCB)功率调制器(PM)。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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