{"title":"Micro device array design and fabrication in monolithic MEMS SoC","authors":"Jung-Hung Wen, W. Fang","doi":"10.1109/NEMS.2012.6196736","DOIUrl":null,"url":null,"abstract":"This study presents novel micro-device-array designs and fabrications potentially for accelerometer, gyro or even bio-sensor applications based on an advanced 0.35μm 4 metal bipolar-CMOS-DMOS (BCD) technology. Structures built by pure metal single layer have better mechanical properties and multi-electrodes design provide more actuating and sensing possibilities for both out-of-plane and in-plane motions and signal fine-tunes. MEMS devices and integrated circuits can be fabricated monolithically. SEMs show the delicate array matrices by post-process micromachining and finished die with circuit area protected by passivation. No warpages are observed by interferometer in our devices, and linear out-of-plane movements are being electrically driven. At last, frequency responses of 14.22 kHz and 2.71 kHz are also characterized for device mode shapes.","PeriodicalId":156839,"journal":{"name":"2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)","volume":"66 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-03-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/NEMS.2012.6196736","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
This study presents novel micro-device-array designs and fabrications potentially for accelerometer, gyro or even bio-sensor applications based on an advanced 0.35μm 4 metal bipolar-CMOS-DMOS (BCD) technology. Structures built by pure metal single layer have better mechanical properties and multi-electrodes design provide more actuating and sensing possibilities for both out-of-plane and in-plane motions and signal fine-tunes. MEMS devices and integrated circuits can be fabricated monolithically. SEMs show the delicate array matrices by post-process micromachining and finished die with circuit area protected by passivation. No warpages are observed by interferometer in our devices, and linear out-of-plane movements are being electrically driven. At last, frequency responses of 14.22 kHz and 2.71 kHz are also characterized for device mode shapes.