Design and analysis of polysilicon thin layers and MEMS vibrating structures

R. Voicu, R. Gavrila, C. Obreja, R. Muller, A. Baracu, M. Michałowski, Z. Rymuza
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引用次数: 6

Abstract

Natural frequencies of an array of microcantilevers designed with different dimensions were analysed using computer simulations. Four different types of polysilicon were obtained in different processing conditions varying the deposition temperatures (580°C, 610°C, 630°C, 650°C). A topography scan, a comparative friction test and adhesive tests (pull off-force measurement) were carried out using Atomic Force Microscope (AFM) in order to characterize the material properties. Mechanical properties such as hardness and Young's modulus have been investigated using the nanoindenter technique. The microcantilevers have been manufactured using polysilicon as structural material and surface micromachining technique.
多晶硅薄层和MEMS振动结构的设计与分析
利用计算机模拟分析了不同尺寸微悬臂梁阵列的固有频率。在不同的沉积温度(580°C, 610°C, 630°C, 650°C)下,得到了四种不同类型的多晶硅。利用原子力显微镜(AFM)进行了形貌扫描、比较摩擦测试和粘接测试(拉力测量),以表征材料的性能。利用纳米压头技术研究了材料的硬度和杨氏模量等力学性能。采用多晶硅为结构材料,采用表面微加工技术制备了微悬臂梁。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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