Capillary Self-Assembly Based Multichip-to-Wafer System Integration Technologies

Abstract

We have proposed and developed 3D integration technologies based on self-assembly using surface tension of liquid from 2005. In this paper, microbump bonding and bumpless bonding in face-up and/or face-down configurations are introduced for fine-pitch interconnect formation. In addition, “non-transfer stacking”, in other word, flip-chip self-assembly and “transfer stacking” called reconfigure-wafer-to-wafer using SAE (Self-Assembly and Electrostatic) carrier are explained.