Production-worthy approach of plasma doping (PD)

B. Mizuno, Y. Sasaki, C. Jin, K. Okashita, K. Nakamoto, T. Kitaoka, K. Tsutsui, H. Sauddin, H. Iwai
{"title":"Production-worthy approach of plasma doping (PD)","authors":"B. Mizuno, Y. Sasaki, C. Jin, K. Okashita, K. Nakamoto, T. Kitaoka, K. Tsutsui, H. Sauddin, H. Iwai","doi":"10.1109/ICSICT.2008.4734785","DOIUrl":null,"url":null,"abstract":"Semiconductors have been successfully produced by the miniaturization of planar transistors and their transformation into a 3D structure. This innovation will realize ideal performance in electric devices. In this article, plasma doping combined with He plasma amorphization (He-PA) and several state-of-the-art rapid thermal processing is shown to be a technology for enabling the fabrication of miniaturized 2D devices and advanced 3D structures.","PeriodicalId":436457,"journal":{"name":"2008 9th International Conference on Solid-State and Integrated-Circuit Technology","volume":"16 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2008-12-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2008 9th International Conference on Solid-State and Integrated-Circuit Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICSICT.2008.4734785","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract

Semiconductors have been successfully produced by the miniaturization of planar transistors and their transformation into a 3D structure. This innovation will realize ideal performance in electric devices. In this article, plasma doping combined with He plasma amorphization (He-PA) and several state-of-the-art rapid thermal processing is shown to be a technology for enabling the fabrication of miniaturized 2D devices and advanced 3D structures.
具有生产价值的等离子体掺杂(PD)方法
通过将平面晶体管小型化并将其转化为三维结构,半导体已经成功地生产出来。这一创新将实现电子器件的理想性能。在这篇文章中,等离子体掺杂与He等离子体非晶化(He- pa)和几种最先进的快速热处理相结合,被证明是一种能够制造小型化2D器件和先进3D结构的技术。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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