Proactive Thermal Management using Memory-based Computing in Multicore Architectures

Subodha Charles, Hadi Hajimiri, P. Mishra
{"title":"Proactive Thermal Management using Memory-based Computing in Multicore Architectures","authors":"Subodha Charles, Hadi Hajimiri, P. Mishra","doi":"10.1109/IGCC.2018.8752127","DOIUrl":null,"url":null,"abstract":"Reliability is a major concern in modern electronic systems due to high defect rates and large parametric variations. A major contributor to reliability concerns is the potential thermal violations due to increasing transistor count coupled with the high clock rate in multicore System-on-Chip (SoC) designs. Dynamic thermal management is widely used to reduce the SoC temperature. Early work on using memory-based computing has shown promising results in improving SoC reliability when few functional units are defective or unreliable under process-induced or thermal variations. However, there are no prior efforts to explore the effectiveness of MBC for thermal management in multicore architectures. In this paper, we present a novel dynamic thermal management technique using proactive memory-based computing to reduce the peak temperature of applications in multicore architectures. The basic idea is to proactively transfer the profitable instructions with frequent operand pairs to memory. Experimental results demonstrate that the proposed computing in memory can significantly decrease the peak temperature to improve the SoC reliability with minor impact on performance.","PeriodicalId":388554,"journal":{"name":"2018 Ninth International Green and Sustainable Computing Conference (IGSC)","volume":"22 6 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"12","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 Ninth International Green and Sustainable Computing Conference (IGSC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IGCC.2018.8752127","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 12

Abstract

Reliability is a major concern in modern electronic systems due to high defect rates and large parametric variations. A major contributor to reliability concerns is the potential thermal violations due to increasing transistor count coupled with the high clock rate in multicore System-on-Chip (SoC) designs. Dynamic thermal management is widely used to reduce the SoC temperature. Early work on using memory-based computing has shown promising results in improving SoC reliability when few functional units are defective or unreliable under process-induced or thermal variations. However, there are no prior efforts to explore the effectiveness of MBC for thermal management in multicore architectures. In this paper, we present a novel dynamic thermal management technique using proactive memory-based computing to reduce the peak temperature of applications in multicore architectures. The basic idea is to proactively transfer the profitable instructions with frequent operand pairs to memory. Experimental results demonstrate that the proposed computing in memory can significantly decrease the peak temperature to improve the SoC reliability with minor impact on performance.
在多核架构中使用基于内存的计算进行主动热管理
由于高缺陷率和大的参数变化,可靠性在现代电子系统中是一个主要问题。在多核片上系统(SoC)设计中,由于晶体管数量的增加以及高时钟速率,潜在的热破坏是可靠性问题的主要因素。动态热管理被广泛用于降低SoC温度。早期使用基于内存的计算的工作已经显示出有希望的结果,当很少的功能单元在工艺引起的或热变化下有缺陷或不可靠时,可以提高SoC的可靠性。然而,在多核架构中,目前还没有研究MBC在热管理方面的有效性。在本文中,我们提出了一种新的动态热管理技术,使用基于主动存储器的计算来降低多核架构中应用的峰值温度。其基本思想是主动将具有频繁操作数对的有益指令转移到内存中。实验结果表明,在内存中计算可以显著降低峰值温度,提高SoC的可靠性,而对性能的影响较小。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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