Low Leakage and High Speed Sub-threshold 128-bit Fin-FET SRAM for Ultra-Low-Power Applications

T. V. Reddy, K. Madhava Rao, R. Reddy, P. Kavitha Reddy
{"title":"Low Leakage and High Speed Sub-threshold 128-bit Fin-FET SRAM for Ultra-Low-Power Applications","authors":"T. V. Reddy, K. Madhava Rao, R. Reddy, P. Kavitha Reddy","doi":"10.1109/CONIT59222.2023.10205883","DOIUrl":null,"url":null,"abstract":"The demand for Low power handheld devices are rapidly increasing in the recent past and memory is the heart of the processor. SRAM architecture of Fin-FETs is the most emerging design used for high computational designs functionality and performance near the sub-threshold region of operation. The demand for customer handheld equipment and rapid growth in technologies leads to high computational and innovative designs, especially in memory architectures. Traditional SRAM using CMOS designs that occupy the maximum area and high leakage power that leads to poor performance operating under a sub-threshold regime. PVT Variations, BTI, sizing, delay along with power consumption are some of the factors affecting performance. Switching is the primary factor that contributes to major leakage at the near-threshold region. The main objective of the proposed model is a literature survey to design a 128-bit FinFET-based SRAM architecture operating under a threshold region. The second objective is to analyze power, SNM, and delay. Comparative analysis of various effects on CMOS and Fin FinFET designs is done in the third objective. The final objective is framed on performance and functionality, and reliability to provide the trade tradeoff between CMOS Vs. FinFET designs.","PeriodicalId":377623,"journal":{"name":"2023 3rd International Conference on Intelligent Technologies (CONIT)","volume":"10 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2023-06-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2023 3rd International Conference on Intelligent Technologies (CONIT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CONIT59222.2023.10205883","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract

The demand for Low power handheld devices are rapidly increasing in the recent past and memory is the heart of the processor. SRAM architecture of Fin-FETs is the most emerging design used for high computational designs functionality and performance near the sub-threshold region of operation. The demand for customer handheld equipment and rapid growth in technologies leads to high computational and innovative designs, especially in memory architectures. Traditional SRAM using CMOS designs that occupy the maximum area and high leakage power that leads to poor performance operating under a sub-threshold regime. PVT Variations, BTI, sizing, delay along with power consumption are some of the factors affecting performance. Switching is the primary factor that contributes to major leakage at the near-threshold region. The main objective of the proposed model is a literature survey to design a 128-bit FinFET-based SRAM architecture operating under a threshold region. The second objective is to analyze power, SNM, and delay. Comparative analysis of various effects on CMOS and Fin FinFET designs is done in the third objective. The final objective is framed on performance and functionality, and reliability to provide the trade tradeoff between CMOS Vs. FinFET designs.
用于超低功耗应用的低泄漏和高速亚阈值128位翅片fet SRAM
近年来,对低功耗手持设备的需求正在迅速增长,而内存是处理器的核心。fin - fet的SRAM架构是最新兴的设计,用于高计算设计,功能和性能接近亚阈值区域的操作。对客户手持设备的需求和技术的快速增长导致了高计算和创新设计,特别是在内存架构方面。传统的SRAM采用CMOS设计,占据最大的面积和高泄漏功率,导致在亚阈值状态下工作性能差。PVT变化、BTI、尺寸、延迟以及功耗是影响性能的一些因素。开关是导致近阈值区域主要漏电的主要因素。该模型的主要目的是通过文献调查来设计一个在阈值区域下工作的128位基于finfet的SRAM架构。第二个目标是分析功率、SNM和延迟。在第三个目标中比较分析了各种影响CMOS和FinFET设计的因素。最终目标是建立在性能和功能以及可靠性上,以提供CMOS与FinFET设计之间的贸易权衡。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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