Addressable Monolithic InSb on GaAs Focal Plane Arrays for MWIR Imaging

D. Cumming, V. Pusino
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Abstract

Mid-wave infrared sensing and imaging is of growing importance for the detection of environmental greenhouse gases such as CO2 and CH4. The ability to survey large infrastructure in addition to making single point measurements will bring many advantages to industrial asset management in particular. Existing technology for MWIR imaging relies on costly flip chipped technology and cryogenic cooling. We have investigated a monolithic integrated technology that can be made in a traditional planar process and operates at room temperature. By growing III-V wafers with a GaAs transistor layer and an InSb photodetection layer we are able to eliminate the need for a two-chip solution and the complex fabrication steps traditionally required. We present the method for making monolithic sensors and preliminary results demonstrating the imaging and gas sensing capabilities of the new technology.
基于GaAs焦平面阵列的可寻址单片InSb用于MWIR成像
中波红外传感与成像在CO2和CH4等环境温室气体的检测中具有越来越重要的意义。除了进行单点测量外,对大型基础设施进行调查的能力将为工业资产管理带来许多优势。现有的MWIR成像技术依赖于昂贵的倒装芯片技术和低温冷却。我们研究了一种单片集成技术,可以在传统的平面工艺中制造,并在室温下工作。通过生长具有GaAs晶体管层和InSb光探测层的III-V晶圆,我们能够消除对双芯片解决方案的需求以及传统上所需的复杂制造步骤。我们提出了制作单片传感器的方法和初步结果,证明了新技术的成像和气体传感能力。
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